Chris Myers


  • Phone: 303-735-0316
  • Email: chris.myers@colorado.edu

Asynchronous circuit design, formal verification of analog/mixed signal circuits and cyber-physical systems, and modeling, analysis and design of genetic circuits

Daniel Drew



Design of autonomous millimeter-scale robots, including MEMS microactuators, mesoscale manufacturing techniques, and electronic system integration.

Yi Zhou



Machine learning, artificial intelligence, mathematical programming, deep learning theory, stochastic and nonconvex optimization, reinforcement learning, distributed machine learning system, statistical signal processing

David Warren


  • Phone: 801-585-2697
  • Email: david.warren@utah.edu
  • Office: BPRB 506E

Yunshan Wang


  • Phone: 801-581-3395
  • Email: yunshan.wang@utah.edu
  • Office: MEB 2284

Inventions for wireless networks which improve their security, reliability, self-awareness, and sensing capabailities; research applies statistical signal processing, networking, and radio propagation techniques

Shadrach Roundy


  • Phone: 801-581-4304
  • Email: shad.roundy@utah.edu
  • Office: MEK 1153

Inventions for wireless networks which improve their security, reliability, self-awareness, and sensing capabilities; research applies statistical signal processing, networking, and radio propagation techniques

John Mathews


  • Email: mathews@oregonstate.edu

Nonlinear and adaptive signal processing and machine learning, with applications in audio and communication systems, neural engineering, biomedicine, and structural health management

Paul Kuhn


  • Email: paul.kuhn@utah.edu

PK Consulting LLC: Electromagnetic and ultrasonic reflectometry imaging, neural networks and machine learning, biomedical sensors and instrumentation, signal and image processing, and reconfigurable electronic architectures

Julia Kőrner


  • Email: koerner@geml.uni-hannover.de

Micro- and nanomechanical oscillation-based sensors, biomedical sensors

Bishnu Gogoi


  • Email: bishnugogoi@axtec-consulting-group.com

MEMS sensors, multi-sensor integration, MEMS-CMOS integration, CMOS and discrete transistor technologies, microfluidics, biotech devices, passives, chip-scale packaging and custom package development